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Atomic Layer Deposition Systems

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Atomic Layer Deposition (ALD) systems are advanced thin-film deposition tools used in semiconductor fabrication, nanotechnology, and materials science research. They provide a precise method for depositing uniform thin films with atomic-level control over thickness and composition.

ALD operates on a self-limiting surface reaction mechanism, where alternating pulses of precursor gases are introduced into a reaction chamber and react with the substrate surface in a sequential manner, forming a monolayer of material one atomic layer at a time.

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