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THIN FILM SYSTEMS & ACCESSORIES

PVD High Vacuum Systems Falcon Series_ed

PVD
High Vacuum Systems

Falcon Series

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PVD
Ultra High
Vacuum Systems

Super Falcon Series

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PVD
Glovebox
Integrated System

Sysline

Atomic Layer Deposition Systems Aldline_

Atomic Layer Deposition Systems
Aldline

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Chemical
Vapour Deposition Systems

Chemline

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Cluster
Deposition Systems

Clusline

Production Coating Systems Advline_edite

Production
Coating Systems 

Advline

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Metallizers

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Custom
Deposition
Systems

ACCESSORIES & COMPONENTS

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HT Cleaning

HT cleaning, often abbreviated as "high-temperature cleaning," refers to a process used to remove contaminants, residues, or impurities from surfaces or materials at elevated temperatures. This cleaning method is commonly employed in various industrial, laboratory, and manufacturing applications where thorough cleaning and removal of stubborn residues are required.

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Substrate heating is a process used in various manufacturing, research, and industrial applications to heat substrates to specific temperatures for processing, treatment, or analysis. The primary purpose of substrate heating is to control the temperature of the substrate during processing to achieve desired material properties, reactions, or outcomes.

Substrate Heating

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The "Z-axis shift" concerning substrates typically refers to movement along the vertical axis in a Cartesian coordinate system. In various applications, particularly in manufacturing, research, and robotics, the Z-axis shift of substrates plays a crucial role. The Z-axis shift refers to the movement or displacement of a substrate along the vertical axis, which is perpendicular to the plane of the substrate. 

Substrate Z-axis Shift

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Substrate biasing is a technique commonly used in various thin-film deposition processes and plasma-based applications. It involves applying a controlled electrical potential (bias) to the substrate during the deposition or treatment process. The primary purpose of substrate biasing is to influence the properties of the deposited thin films or the surface treatment process. 

Substrate Biasing

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Substrate cooling is a critical process in various industrial applications, particularly in manufacturing, materials science, and semiconductor fabrication. It involves the controlled reduction of substrate temperature during or after processing to achieve specific material properties, improve process control, and ensure product quality. 

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Substrate rotation is a technique used in various manufacturing and processing applications to achieve uniformity, enhance deposition, and optimize material properties across a substrate's surface. It helps overcome non-uniformity issues that may arise due to equipment geometry, gas flow patterns, or other factors, thereby improving process reliability and product quality.

Substrate Cooling

Substrate Rotation

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A load-lock system is a critical component in many vacuum-based processes, particularly in semiconductor manufacturing and thin-film deposition technologies. It serves as an intermediary chamber between the atmosphere and the main process chamber, allowing for the introduction and removal of substrates or samples without compromising the vacuum environment within the main chamber. 

Load-lock

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Substrate biasing is a technique commonly used in various thin-film deposition processes and plasma-based applications. It involves applying a controlled electrical potential (bias) to the substrate during the deposition or treatment process. The primary purpose of substrate biasing is to influence the properties of the deposited thin films or the surface treatment process. 

Linear Transfer Arm

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Low Temperature Evaporator (LTE)

A Low Temperature Evaporator (LTE) is a specialized apparatus used in various thin-film deposition processes, particularly in vacuum-based techniques such as physical vapor deposition (PVD) and molecular beam epitaxy (MBE). The LTE enables the deposition of thin films at low temperatures, often below 100°C. 

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Magnetron Guns

Magnetron guns are crucial components in various physical vapor deposition (PVD) techniques, such as sputtering, used for depositing thin films onto substrates in semiconductor manufacturing, optical coatings, and other industries. Magnetron guns are designed to generate and control plasma in vacuum chambers for sputtering processes. 

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Thermal Evaporation Sources

Thermal evaporation sources are key components used in physical vapor deposition (PVD) processes to deposit thin films of materials onto substrates. These sources are designed to heat solid material to its evaporation temperature, causing it to transition directly from a solid to a vapor phase. 

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RF Power Supplies

RF (Radio Frequency) power supplies are essential components used in various industrial applications, particularly in radio frequency (RF) plasma generation, induction heating, RF sputtering, and other RF-based processes. These power supplies convert electrical power from the mains into high-frequency alternating current (AC) signals, typically in the RF range (from tens of kHz to several MHz), to drive RF-based equipment. 

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HIPMS

HIPMS, or High Power Impulse Magnetron Sputtering, is an advanced technique used in physical vapor deposition (PVD) processes for depositing thin films with enhanced properties. It is an evolution of conventional magnetron sputtering techniques and offers several advantages.  HIPMS is employed to deposit thin films with improved adhesion, density, and other desirable properties compared to traditional magnetron sputtering techniques. It is particularly useful for depositing high-quality coatings on various substrates, including metals, semiconductors, and ceramics.

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